Stion to transfer thin film CIGSS technology to TSMC
16. June 2010 | Industry & Suppliers | By: Becky StuartThe Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) and Stion Corp., a thin film photovoltaics module manufacturer, have reached a series of agreements covering technology licensing, supply and joint development.
Under the agreements, Stion will license and transfer its thin film CIGSS technology to TSMC, while TSMC will provide a certain quantity of solar modules to Stion using the technology. TSMC and Stion have also said they will work together to enhance the thin film technology through joint development.
Additionally, VentureTech Alliance, a TSMC affiliate, will invest USD$50 million to take a 21 percent stake in Stion.
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