ITW Solar's Insulcast line of electronic potting and encapsulants will be on display next week at Solar Power International in Las Vegas, USA, from October 21-23 in booth # 2712. They are specifically designed to have low viscosity and higher thermal conductivity. These two capabilities allow for smaller power electronic components. Smaller, more complex packaging requires a lower viscosity material to flow into the packaging void free while the higher thermal conductivity helps reduce the component operating temperature for more efficient power conversion.
Insulcast products are ideal for junction boxes, microinverters, power optimizers, and many other power systems and components in the solar industry. Insulcast products were developed to withstand severe thermal and mechanical shock, and have been used for more than 30 years in a variety of high reliability applications within aerospace, automotive and electronics. This translates to increased mechanical protection during transportation and installation, and reduced solder joint fatigue during thermal cycling.
Insulcasts wide range of potting and encapsulants allows manufacturers more freedom in design and more confidence in the reliability of their assemblies. For applications requiring higher thermal conductivity, lower viscosity, superior thermal cycling capability and improved adhesion, Insulcast can provide the solution.
For any inquiries, please contact ITW Solar at info@itwsolar.com or visit www.itwsolar.com.
Find ITW Solar at Solar Power International in Las Vegas, USA from October 21 23 in Booth 2712.
