Featured in FUTURE PV – 09-2014

The disruptive potential of thin and kerfless wafers

Thin c-Si: The ultimate goal of thin and kerfless wafer technologies is to achieve competitive efficiencies at lower production costs, using less material in the process. A few innovative startups are already making encouraging strides in the U.S., finds pv magazine, and could deliver a superior solar solution within the next five years.

In late July, a thin silicon solar technology startup based in an office park on the outskirts of Silicon Valley announced that it had raised $31 million in venture capital (VC) in its fourth funding round. This is a lot of money, particularly given that VC for solar manufacturing technologies dried up in mid-2012. Many …

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