1366 Technologies names vice president of manufacturing

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Silicon wafer manufacturer 1366 Technologies has announced it has appointed Brian Eller vice president of manufacturing.

In the newly created role, Eller will lead 1366's manufacturing operations as the company prepares for the commercial scaling of its innovative Direct Wafer technology.

Eller brings nearly 20 years of multi-national manufacturing, quality, engineering and plant management knowhow to 1366.

For the past 10 years, he has held senior leadership roles in the high-growth, high-margin pharmaceutical division and lighting and imaging division at SCHOTT, a multi-billion dollar company with more than 125 years of experience in the areas of specialty glasses and materials and advanced technologies.

Most recently, Eller served as vice president of operations, North America, where he held full responsibility for multiple plants – all meeting rigorous good manufacturing process (GMP) requisites – in the United States and Mexico.

"Brian's track record in building and running modern, efficient, high-volume businesses makes him a critical addition as we increase production rates and prepare to break ground on our 250 MW facility," said Frank van Mierlo, CEO of 1366 Technologies.

"Our momentum continues, and Brian will play an integral role in advancing our efforts and building our team."

Eller also held management positions and process engineering roles at Gerresheimer Glass and Alcatel Alsthom, respectively.

"1366 Technologies has assembled one of the top technology teams in the solar industry, and I look forward to contributing to the launch of our commercial scale manufacturing operations," said Eller.

"1366's Direct Wafer has the potential to revolutionize wafer manufacturing. To join as we ramp to high-volume production is the opportunity of a lifetime."

1366's Direct Wafer production machines have now demonstrated manufacturing rates of 2,000 wafers per furnace per day.

The team continues to accelerate production in order to reach its manufacturing goal of yielding three times more wafers than standard wafer processes using the same space.

The company plans to announce the location of its U.S.-based 250 MW facility within six to nine months.

www.1366tech.com