Last month’s SNEC exhibition in Shanghai featured a number of discussions about next-next-generation manufacturing. And with a range of technology pathways now available — including heterojunction (HJT), n-type TOPCon and even various tandems on the cell level, as well as bifacial, shingled, paved or ‘closely packed’ configurations on the module level — the materials supply business is becoming ever-more diverse. But for Ethan S. Simon, the CTO of DuPont’s billion-dollar Photovoltaics and Advanced Materials division, the move to HJT may not occur at the speed that many expect.
Ethan S. Simon: “As industries mature, it’s common to see technologies with well-developed manufacturing infrastructure maintain a dominant position for a longer period than people expect before a ‘better’ technology becomes the standard.”
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