Arnold Gruppe, Weilburg/Deutschland now has transferred their successful machine concept for multi-crystalline silicon bricks also to the mono-crystalline brick production.
In September 2011, Arnold Gruppe will present for the first time ever, during one of the most important international industrial exhibitions for photovoltaics in Hamburg (PVSEC), two new processing machines enlarging their scope of supply. Both novelties, the newly developed fully automated cropping center type 72/454 as well as the cropping saw type 72/476 working at high production accuracy, are completing the processing and automation technology for mono-crystalline ingot processing already available from Arnold Gruppe.
The new cropping center, designed for ingot length up to 3,000 millimetres, has been designed for automated cutting of cones (top and tail pieces), test wafers as well as cutting to length of mono-crystalline ingots into defined segments between 250 and 1,000 millimetres. Optionally it is possible to crop either raw ingots (as grown) or already squared ingots, depending on the type of pre-process choosen by the manufacturer. The work flow of the machine is configured in a way that the operator will be able to load and unload the machine in a most flexible manner avoiding interruption of the production cycle.
Thanks to continuous production in the sawing area the machine will achieve an excellent utilisation rate. Based on Failure Mode and Effect Analysis (FMEA) the vertical construction principle of the machine bed and sawing unit have been developed. Hence optimal accessibility of all machine guidances, drives, electrical installations and cutting disc is guaranteed.
The new ingot squaring saw is characterized by its high production accuracy, productivity, cost effectiveness as well as high life time. The vibration reducing stiff machine basis, consequent further development of thin plate sawing technology, easy handling and continuous process control are only a few features which excel this machine. The flexible clamping concept allows to either square an ingot as a whole (as grown) or cropped ingot segments. The enormous loading capacity of 3,000 millimetres for either one complete ingot or up to five single – already cropped segments from 180 to 1,000 millimetres is an enormous advantage as optimal machine load is always possible.
Both novelties are equipped with the Arnold thin blade sawing technology. This leads to an enormous reduction in kerf loss due to sawing blade thickness of only 1.5 millimetres. Compared to commercially available blade thickness of up to 3.5 millimetres loss of silicon will be more than halved. Both machines incorporate the Arnold process analysis tool with an open interface to the higher-ranking MES (Manufacturing Executing System).
Arpat, the Arnold Remote Production Analysis Tool, collects, analyses, records and visualises the individual processes and parameters. The robust and low-maintenance machine design of both product novelties results in high machine availability and extremely low operating costs (TCO). The squaring saw is immediately available and will be realized including automation concepts on request. The cropping saw will be available by end of 2011. Further details, prices and delivery time are to be inquired from supplier.
Company Contact: Arnold Gruppe Herbert Arnold GmbH & Co. KG Wolfgang Schürgers CSO Weilstraße 6 35781 Weilburg Germany Phone: +49 (0)6471 9394126 Fax: +49 (0)6471 2065 wolfgang.schuergers@arnold-gruppe.de
