MB Wafertec the technology leader for precise cropping and slicing equipment of the Meyer Burger Group steadily expands its product portfolio and is getting closer to its vision from crystal boule to epi ready wafer.
In addition to its DS 265 sapphire MB Robotics is offering 3D core adjustment, an integrated solution for automated measuring and gluing as well as compensating inaccurate orientation of the cores.
Until now preparing of the cores for wafering has been done manually while considering 2 dimensions only. Thats why this used to be the most critical process step in manufacturing sapphire wafers. Crystal axes are not visible to humans.
Even slight deviance in positioning the core in the wire web can imply that the cores get worthless. With 3D Core Adjustment Meyer Burger offers a unique and patented mode guaranteeing highest wafer quality and process stability / repeatability representing a milestone for sapphire wafer manufacturing. Cores in 2, 4 and 6 format are processed.
Deviance of C-axis of the cores are calculated 3 dimensional and with highest accuracy. The beams are perfectly prepared by milling for accurate positioning of the cores. The c-axis of the cores now are parallel to the machine plane and the perfectly oriented cores can be sliced into wafers in the wire saw.
The malpositions of the cores are measured by x-ray and the milling station is programmed automatically. Core, beam and workpiece holder are glued together in the gluing station. In the manual as well as in the semi-automated gluing station the pieces are positioned manually, in the fully automated version by robots.
On the other hand in the semi and in the fully automated version the glue is applied by robots and in the manual version by hand.
