"We're looking forward to introducing one of our newest products at SNEC, SOL315," said Andy London, Vice President of Heraeus Precious Metals North America Conshohocken LLC in West Conshohocken. "This product helps to significantly improve output and efficiency by reducing the recombination of charge carriers."
The SOL315 is screen printed and fired onto passivated silicon wafers without penetrating the passivation layer. SOL315 has a reduced silver content and has demonstrated greater than 15 percent less paste consumption per cell for new passivation layer cell designs relative to conventional metallization pastes. Other benefits include high mechanical adhesion and excellent soldering compatibility. SOL315 can be used for front-side floating busbars and back-side soldering pad applications.
To learn more about Heraeus' metallization pastes for the photovoltaic industry, visit us at this year's SNEC trade show at the Shanghai New International Expo Center, 2345 Longyang Road, Pudong District, Shanghai, Hall W3 booth number 250.
