Ultrasonic soldering is a significant technique used for flux-less soldering onto difficult to solder materials including glass, ceramics, aluminum, stainless steel, molybdenum, ITO films and silicone. Applications include medical electronics, automotive, solar batteries and modules, and flat panel display manufacturing.
By emitting ultrasonic waves to the soldering tip, negative pressure is created by cavitations. The energy produced promotes the removal of any contamination, oxides and air bubbles that are present, leading to significantly improved adhesion of solder to the material being soldered.
