The cracks are showing
The most common way to cut a cell is a “scribe and break” process. This sees the rear of the cell first scribed by a laser through about one-third of its thickness. In the next step, mechanical force is applied along the scribed line to break the cell in two. Despite the level of sophistication, with this process there is an inherent risk of microcracks forming at the cell edge during scribing. In addition to crack formation, cell cutting processes also involve the risk of damaging the extremely sensitive passivation layers.
Image: Innolas Solutions
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