RSP Technology applies a fine line screen printed seed layer that is then electroplated with a smooth silver layer, resulting in increased efficiencies at a significantly reduced cost. The bath operates at 20 g/l silver, a concentration similar to most other baths in the industry, but because of key advances in its formulation TechniSol Ag 2460 produces very fine grain deposits with no lateral growth. This improved electrolyte formulation also allows manufacturers to plate up to 30 percent faster and still maintain optimum deposit integrity.
In addition to the advantages in RSP Technology, TechniSol Ag 2460 may be used to plate on nickel or copper grid lines, creating a superior solderable layer. TechniSol Ag 2460 is also formulated for compatibility with LIP (Light Induced Plating) as well as standard electroplating applications.
RSP Technology can reduce front side metallization costs up to 50 percent, while also improving cell efficiency. TechniSol Ag 2460 maximizes these efficiency gains and improves cell through-put, which establishes it as a leading silver plating solution in the solar industry, explianed Anthony Gallegos, Technic Global Product Manager for Solar Technology.
