Wafer metrology sorter system

Schmid’s Wafer Metrology Sorter System has only been available for a short time, with its own developed Wafer Production Analyzer Software for thickness, Total Thickness Variation (TTV) and roughness.
By
pv magazine

Schmid’s analyzer software compiles the measurement data of the finished wafers in a 3D brick, which establishes the basic information for specific intervention in the upstream production steps. The visual display of the surface roughness distribution on a wafer, as well as the distribution on all the wafers in the entire brick, allows important conclusions to be drawn about the cutting parameters. Upon request, the machine can be inspected and tested.
A6.490

This content is protected by copyright and may not be reused. If you want to cooperate with us and would like to reuse some of our content, please contact: [email protected].

Written by

This content is protected by copyright and may not be reused. If you want to cooperate with us and would like to reuse some of our content, please contact: [email protected].

Comments