The purpose of the tool is to remove the highly doped layer from the backside and the edges of a wafer, and thereby produce a chemical edge isolation (CEI). In a second process step, the remaining phosphor silicate glass layer on the front side of the wafer that was created during the previous diffusion process step, is removed. Throughput will be up to 4,800 wafers per hour. The machine will be sold as a bundle with the Manz SpeedPicker for loading and unloading. Manz will follow up with new vacuum coating equipment and a new texturing tool soon.
A6.380
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