Gaoce has produced its first wafers at a facility in Yibin, Sichuan province. The factory has a planned wafer-cutting capacity of 50 GW. It will be built in two phases, with the initial 25 GW phase to reach full capacity by June 2024. Gaoce has entered the wafer-cutting market with its self-developed GC-800XP Diamond Wire Crystalline Silicon Slicer, which can handle larger sizes and thinner pieces via its advanced control systems.
Daqo New Energy said its previously announced share buyback initiative has reached a milestone of $491 million, approximately 70.1 % of the $700 million maximum it has allocated for the program.
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