Gaoce has produced its first wafers at a facility in Yibin, Sichuan province. The factory has a planned wafer-cutting capacity of 50 GW. It will be built in two phases, with the initial 25 GW phase to reach full capacity by June 2024. Gaoce has entered the wafer-cutting market with its self-developed GC-800XP Diamond Wire Crystalline Silicon Slicer, which can handle larger sizes and thinner pieces via its advanced control systems.
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Daqo New Energy said its previously announced share buyback initiative has reached a milestone of $491 million, approximately 70.1 % of the $700 million maximum it has allocated for the program.
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