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DC Power Systems and Solar Depot announce today their integration to create the premier distribution company in the solar energy industry.
Zhengrong Shi, founder and CEO of Suntech Power, received the “Murphy&Spitz Global Leader Award 2011” at the World Economic Forum. With the award, Murphy&Spitz honors Shi’s company for its exemplary environmental and sustainability standards.
Schott Solar PV, Inc. and BuiltSmart Resources were joined by Mayor Julian Castro for the grand opening of San Antonio’s first Net Zero Green Home. The BuiltSmart Resource Center achieved a Home Energy Rating System (HERS) score of negative three, making it one of the most energy efficient homes in Texas.
Kyocera Corporation has installed more than 1,200 solar power generating systems at public schools in Japan ranking Kyocera as the No.1 supplier in this segment of the Japanese market.
BioSolar, Inc., developer of a technology to produce bio-based materials from renewable plant sources that reduce the cost of photovoltaic (PV) modules, announced that production samples of its innovative BioBacksheet product have successfully completed all critical Underwriter’s Laboratories (UL) initial material property tests and is expected to officially obtain full UL material certification soon.
The 26th European Photovoltaic Solar Energy Conference and Exhibition (26th EU PVSEC) will take place in Hamburg, Germany, at the CCH Congress Centre and International Fair Hamburg. The conference extends over five days from 5 to 9 September 2011.
Global manufacturer and solar system house, Parity Solar, has installed an innovative building integrated photovoltaics (BIPV) system in Zhenjiang City, China, in order to demonstrate new technology.
Enecsys Limited, a PV micro-inverter company, has announced UL certification for its products.
9REN will realize for Helios Srl (OTT Group) a one megawatt (MW) plant in the province of Trapani, Sicily, Italy.
The TRITAN dual-lane metallization firing system will be premiered in Hall E3, Stand 590. This state-of-the-art system features increased throughput at 3,600 wafers per hour, an edge-grip transport system and a temperature spike faster than three seconds.
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