Meyer Burger picks up diamond wire saw order from SunEdison


Signs of significant equipment upgrades right across the PV supply chain continue to surface. The latest comes from SunEdison, which will begin producing its mono wafers utilizing Meyer Burger’s DW288 diamond wire technology in the second half of 2015. Meyer Burger will begin delivery f the equipment in Q2 2015. SunEdison carried out an on-site evaluation of the technology in its wafer fab before deciding on the technology.

Meyer Burger claims its diamond wire cutting technology can produce “ultra thin” mono wafers at twice the cutting speed when compared to slurry wafering. This increases wafer output, but is also understood to deliver significantly more efficient production, through the minimization of ingot wastage in the wafering process.

The Swiss company supplies not only the wafering equipment but also the diamond wire itself providing it with ongoing consumables supply business. Meyer Burger's Diamond Wire Management System was shortlisted in the Solar Award 2014 in the category PV Tool Award.

SunEdison has indicated that the technology will be employed to meet the growing demand for high quality mono wafers.

Michael Escher, Meyer Burger’s CCO, said that the contract provides confirmation of the company’s leading role in driving technology change with solar production.

“We are proud to work with SunEdison as a long-term partner sharing a common commitment to the development of the renewable energy market,” said Escher. “This achievement underlines our commitment and dedication to providing advanced high-tech solutions to leading companies in high-growth industries.”

The March edition of pv magazine includes a feature on diamond wire technology.

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