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Modules & Upstream Manufacturing

Process optimization tools

KIC has come up with new products for process optimization. The e-Clipse thermocouple attachment fixture offers repeatable profile data attainment.

Precision control systems

Manz Automation is set to introduce its next generation of mechanical scriber tools at this year’s EU PVSEC.

Minimizing reel changing times

Mondragon Assembly has developed a new tabber and stringer model, TS-600 LT. The modular configuration has the possibility to upgrade it at any time. The machine can be ordered with various string loading options.

Transport and handling solutions

Montech is introducing a number of new products under production technology. To handle wafers, the company has developed a new vacuum conveyor; an overhead conveyor that carries wafers at a speed of two meters per second.

Improving the production line

Swiss-based Oerlikon Solar is improving its production line with a solution for thin film silicon solar modules. It is a further development of its existing production line, with a reduction of lead time and better performance of solar modules.

Electro-luminescence measurements

Reis Robotics news production technology measures the quality of strings before laying them into the matrix. The extended system allows the complete matrix to be assessed before the lamination process.

Horizontal large area mapping

Sentech’s SenSol Haze enables the horizontal large area mapping of haze and film thickness of Transparent Conductive Oxide (TCO) on glass sheets.

Cost-effective alternative

U.S. based Sono-Tek has come up with ultrasonic coating equipment, which includes a high-speed ultrasonic reciprocating coating system, the HyperSonic.

Standardizing for reliability and low costs

Solon’s Velocity MW utility-scale solar systems are built up from identical, one megawatt clusters to achieve high energy output with performance, short construction cycles, improved reliability and reduced overall project risk.

Gripping without contact

Zimmermann and Schilp has introduced a non-contact gripper that is based on ultrasonic sound for module glass substrates. In order to create a safe transport system, the system maintains the balance between the attracting and repelling forces.

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