Swiss solar production equipment manufacturer Meyer Burger has confirmed today that it has been awarded a CHF 12 million ($12.4 million) contract to supply Norwegian solar manufacturer REC Group with its DW 288 Series 3 diamond wire cutting technology.
The delivery of the tooling equipment – which is used for the slicing of multicrystalline wafers – will begin in the third quarter of the year, shipping out to REC’s Singapore manufacturing operation.
Meyer Burger will also install and commission the tools, as well as offering on-site training and support.
REC Group said that after an extensive search and in-depth technical evaluation, it is now committed to shifting its entire multi-silicon wafer slicing to diamond wire cutting technology. “Our success is based on cutting-edge and cost-effective manufacturing technology,” said REC Group CEO Steve O’Neil, who added that Meyer Burger’s tooling will enable REC to continue providing higher quality solar components while remaining competitive on price.
Last month, Meyer Burger received a large order for its MB PERC cell technology from two existing clients in Asia, and has generally enjoyed a strong first half of the year in terms of revenues and orders since its restructuring in 2016.